Dr. Lisong Zhou / 周立嵩

Dr. Lisong Zhou / 周立嵩

CTO / 技術長

Flex, Ltd / 偉創力股份有限公司


Dr. Zhou holds a Bachelor of Science degree in Electronics Engineering from Tsinghua University, Beijing, China, and a PhD degree in Electrical Engineering from Pennsylvania State University.


In his current role, Dr. Zhou is the lead of technology and engineering in Flex Solar. Prior to joining Flex, Dr. Zhou was responsible for product management in DSM division at Applied Materials. Prior to that, he was director of marketing at Applied Microstructures where he led the company's strategic growth initiative in MEMS industry. Prior to that, he was Sr. manager of business development at Intevac where he led the successful penetrations of disruptive solar cell manufacturing technologies in China and Taiwan. Earlier in his career, he started as process engineer in Applied Materials and later grow to product manager in display and solar business groups at Applied Materials. Lisong has received the prestigious IEEE George E. Smith Award in 2005 for his innovative work in flexible displays.


Topic: Shingled Array Module – Process and Performance

Solar module efficiencies and power ratings has continued to advance along with the cost reduction in the industry. In the past, module manufacturers were solely relying on innovations at the cell level in order to improve solar module performance and keeping the simple assembly process using metal ribbon soldering process for solar cells interconnections. The ribbon soldering interconnection is quite mature and has been proven reliable with low manufacturing cost. Lately, new innovations are slowly implemented to improve PV panel output power independent from cell efficiency, such as, reflective ribbon or film, multiple busbars, half cells, bifacial, and glass-glass structure. With various incremental benefits, the fundamental limit of soldering process remains. With the conventional ribbon soldering assembly, the modules still suffer from high shading loss and resistive loss therefore resulting in lower module efficiency. In addition, it limits the usage of very thin wafers due to the nature of high stress from soldering process. Flex has developed a Shingled cell Array Modules (SAM) technology and demonstrated its superior power and reliability performance. First of all, SAM process eliminates the cell bus-bar shading by overlapping the cell bus-bar interconnection to the rear side of cell strips and eliminates the cell to cell spacing within a string. As the result, it achieves extremely high ratio of active generation area over total module area. In addition, the SAM can reduce the resistive loss by series interconnecting 1/4 - 1/6 cell strips in the string. With the reduced loss, module power can be effectively increased by 10%. The conventional ribbon assembled modules suffer the biggest failure mode in the field due to thermal mechanical fatigue resulted from rigid solder bond and CTE mismatch between different materials. SAM process replaces the conventional soldering process with electrical conductive adhesives (ECA) interconnection of cell strips, which significantly reduces the stress of the interconnection therefore improves the module reliability performance. In addition, SAM module shows better shade tolerance and hot spot performance due to its nature of using smaller cell strips hence lower current in the string. Besides all the technical benefits, SAM process can further reduce the overall module cost in $/W. As cell cost has become less than half of total solar module cost, it is more economical to put in more silicon cells per unit area to achieve higher efficiency and further reduce the module cost. In addition, SAM process enables the use of thinner wafers to further reduce the cell cost.

Share page with AddThis